個人簡歷
1985.09-1989.07：大慶石油學院石油機械專業，獲學士學位1989.09-1992.03：哈爾濱工業大學機械設計專業，獲碩士學位
1992.03-1995.11：哈爾濱工業大學機械設計專業，獲博士學位
1998年於大連理工大學機械工程專業博士後出站留校任教，現任大連理工大學精密與特種加工教育部重點實驗室教授、博士生導師。
社會兼職
中國機械工程學會生產工程分會光整加工技術委員會副主任委員中國機械工程學會特種加工分會青年工作委員會委員
中國機械工程學會生產工程分會青年工作委員會委員
研究領域（研究課題）
主要研究方向是精密與超精密加工技術、難加工材料高效加工技術、特種加工及其控制技術。主持國家973計畫子課題2項、國家自然科學基金委重大研究計畫培育項目1項、國家自然科學基金面上項目2項、遼寧省科學基金2項、GF預研項目2項、大連市科技計畫項目1項。作為主要研究人員參加完成國家自然科學基金重大項目、重點項目各1項、國家自然科學基金面上項目2項，以及多項國防預研和橫向協作項目。發表學術論文60餘篇，其中SCI、EI檢索40餘篇，申報發明專利14項。獲得教育部技術發明一等獎1項，航天部科技進步三等獎2項。碩博研究方向
1、精密與超精密加工技術2、難加工材料高效加工
3、特種加工及其控制技術
出版著作和論文
共發表論文60餘篇，近年來主要論文有：1. Zewei Yuan, Zhuji Jin, Renke Kang andQuan Wen.Tribochemical polishing CVD diamond film with FeNiCr alloy polishingplate prepared by MA-HPS technique. Diamond & Related Materials, 2012, 21, pp.50-57.
2. Zewei Yuan, Zhuji Jin, Quan Wen and KunWang. Polishing CVD diamond wafer by compound methods. International Journal ofMachining and Machinability of Materials, 2012.1.
3. Z.J. Jin, Z.W. Yuan, Q. Li and K.Wang. TribologicalAspects of Chemical Mechanical Polishing Diamond surfaces. Key EngineeringMaterials, 2011,325, pp. 464-469.
4.Heng Zhen Dai, ZhuJi Jin, Shang Gao, Z.C. Tao. Research on the Chemical-Mechanical Grinding (CMG)Tools for Al2O3 Ceramic. Advanced Materials Research,2011, 325, pp 270-275.,
5. Wei Si Li, DongMing Guo, Zhu Ji Jin, Zhe Wang, Ze Wei Yuan. Effects of High DielectricConstant Abrasives on ECMP, Applied Mechanics and Materials, 2011, 121-126, pp3263-3267
6. 苑澤偉, 金洙吉, 王坤, 溫泉.CVD金剛石膜高效超精密拋光技術, 納米技術與精密工程, 2011, 9(5), 451-458.
7.周平, 郭東明, 康仁科, 金洙吉. 多級粗糙間隙內的兩相微流動數值模擬, 機械工程學報, 2011,47(15), 83-88.
8. 周平, 郭東明, 金洙吉, 康仁科. 多級粗糙表面對拋光液微流動影響的數值分析, 機械工程學報, 2011, 47(9),169-174.
9. Guo Dongming, XuChi, Kang Renke and Jin Zhuji. Model analysis and experimental investigation ofthe friction torque during the CMP process, Journal of Semiconductors, 2011,32(3), 036002.
10. Wang Cailing, KangRenke, Jinzhuji and Guo Dongming. Effects of the reciprocating parameters ofthe carrier on material removal rate and non-uniformity in CMP. Journal ofSemiconductors, 2010, 31(12), 126001.
11. Xu Chi, GuoDongming, Jin Zhuji, Kang Renke. A signal processing method for thefriction-based endpoint detection system of a CMP process. Journal ofSemiconductors, 2010, 31(12), 126002.
12. 王彩玲, 康仁科, 金洙吉. 一種用於化學機械拋光的加壓裝置設計研究. 中國機械工程, 2010, 21(7),839-842.
13. 劉瑞鴻, 郭東明, 金洙吉, 康仁科. 摩擦化學反應活化能在SiO2-CMP中的作用, 納米技術與精密工程, 2010, 8(3), 275-280.
14. Jin ZJ, Yuan ZW, Kang RK and Dong BX.Fabrication and Characterization of FeNiCr Matrix-matrix-TiC composite forpolishing CVD diamond film. Journal of Material Science and Technology, 2009,25(3), pp 319-324.
15. Z.J.Jin, Z.W.Yuan, R.K.Kang andB.X.Dong. Study on two kinds of grinding wheels for dynamic friction polishingof CVD diamond film, Key Engineering Materials, 2009, 389-390, pp 217-222.
16. MA Xingwei, JINZhuji, YAN Shi, XU Jiujun. Effect of La2O3 onmicrostructure and high-temperature wear property of hot-press sintering FeAlintermetallic compound. JOURNAL OF RARE EARTHS, 2009, 27(6), pp 1031-1036.
17. 郭曉光, 郭東明, 康仁科, 金洙吉. 機群系統上單晶矽磨削過程分子動力學仿真並行化研究. 系統仿真學報, 2009, (10),2850-2854.
18. Z. W. Yuan, Z. J. Jin, B. X. Dong andR. K. Kang. Polishing of free-standing CVD diamond films by the combination ofEDM and CMP. Advanced Materials Research, 2008, 53-54, pp 111-118.
19. Z.J. Jin, X.W. Ma and Z.W. Yuan. Thehigh-efficient low-cost wheel-grinding technology for CVD diamond films,Advanced Materials Research, 2007, 24-25, pp 295-302.
20. F.W. Huo, Z.J.Jin,R.K.Kang, D.M.Guo. A method for grinding mode indentification in grinding ofsilicon wafers. Adwance Materials Research. 2007, 24-25, pp 255-230.
21. F.W. Huo, Z.J.Jin,et al. Experimental investigation of brittle to ductile transition of singlecrystal silicon by single grain grinding. Key Engineering Materials. 2007, 329,pp 433-438.
22. 霍鳳偉，金洙吉，康仁科，郭東明. 金剛石砂輪形貌測量中的磨粒識別研究. 大連理工大學學報, 2007, 47（3）, 358-362.
23. J.Y.Liu, Z.J.Jin,D.M.Guo, R.K. Kang. Effects of suspending abrasives on the lubricationproperties of slurry in chemical mechanical polishing of silicion wafer. KeyEngineering Materials, 2006, 304-305, pp 359-363.
24. J.Y.Liu, D.M.Guo,Z.J.Jin, R.K. Kang. A suspeding abrasives and porous pad model for the analysisof lubrication in chemical mechanical polishing, Key Engineering Materials,2006, 315-316. pp 775-778.
