個人簡介
龍旭，博士（新加坡南洋理工大學），西北工業大學副教授。作為項目負責人，龍旭博士現主持國家自然科學基金一項，陝西省自然科學基金一項，航天科學技術基金一項，華為創新研究計畫（HIRP OPEN）一項，中央高校基本業務費項目兩項及中國航天科技集團公司外協項目一項。近年來以第一作者和通訊作者在International Journal of Mechanical Sciences、Journal of Materials Science、Materials Science & Engineering: A、Journal of Materials Research、International Journal of Applied Mechanics等主流期刊上發表論文39篇，SCI收錄24篇，其中以第一作者在SCI期刊發表17篇（中科院二區期刊收錄4篇，三區期刊收錄4篇），EI收錄14篇。此外，所發表期刊ACI Structural Journal為結構工程研究領域國際頂級SCI期刊，Engineering Structures為結構工程中極少數SCI二區期刊之一。
期刊文獻
1.X Long*, Wenbin Tang, Yihui Feng, YaoYao, Leon M. Keer (2018). Strain rate sensitivity of sintered silver nanoparticles using rate-jump indentation.International Journal of Mechanical Sciences. V. 140, pp 60-67. (Q2, IF=3.192)
2.X Long*, WB Tang, MF Xu, LM Keer, Y Yao (2018). Electric current assisted creep behaviour of Sn-3.0Ag-0.5Cu solder.Journal of Materials Science, V. 53, No. 8, pp 6219-6229. (Q2, IF=2.326)[5]
3.X Long*, WB Tang, SB Wang, X He, Y Yao (2018). Annealing effect to constitutive behavior of Sn-3.0Ag-0.5Cu solder.Journal of Materials Science: Materials in Electronics, V. 29, No. 9, pp 7177–7187. (Q3, IF=2.019)
4.X Long*, YC Liu, Y Yao, FR Jia*, C Zhou, YH Fu, YP Wu (2018). Constitutive behaviour and life evaluation of solder joint under the multi-field loadings.AIP Advances, V. 8, No. 085001, pp 1-12, DOI: 10.1063/1.5044446. (Q3, IF= 1.653)
5.Y Yao*,X Long, LM Keer* (2017). A review of recent research on the mechanical behavior of lead-free solders.Applied Mechanics Reviews, V.69, No.4, 040802. (Q2, Mechanics Q1, IF=7.921)
6.X Long*, X He, Y Yao* (2017). An improved unified creep-plasticity model for SnAgCu solder under a wide range of strain rates.Journal of Materials Science, V.52, No.10, pp. 6120-6137. (Q2, IF=2.326)
7.X Long*, SB Wang, YH Feng, Y Yao, LM Keer (2017). Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments.Materials Science & Engineering: A, V. 696, No.1, pp. 90-95. (Q2, IF=2.541)
8.X Long*, SB Wang, X He, Y Yao* (2017). Annealing optimization for tin-lead eutectic solder by constitutive experiment and simulation.Journal of Materials Research, V.32, No.16. pp. 3089-3099.(Q3, IF=1.680)
9.X Long*, YH Feng, Y Yao (2017). Cooling and annealing effect on indentation response of lead-free solder.International Journal of Applied Mechanics, V.9, No.4, 1750057. (Q3, IF= 1.468)
10.HC Guo,X Long*, Y Yao* (2017). Fire resistance of concrete filled steel tube columns subjected to non-uniform fire conditions.Journal of Constructional Steel Research, V.128, pp. 542-554.(Q3, IF=1.464)
11.JD Wang,X Long, Y Yao*(2017). Effects of aging temperature on tensile and fatigue behavior of Sn-3.0Ag-0.5Cu solder joints.Journal of Materials Science: Materials in Electronics, V.28 (19), pp. 14884-14892. (Q3, IF=2.019)
12.SB Wang, Y Yao*,X Long(2017). Size effect on microstructure and tensile properties of Sn3.0Ag0.5Cu solder joints.Journal of Materials Science: Materials in Electronics, V.28 (23), pp. 17682-17692. (Q3, IF=2.019)
13.Y Yao*, R An,X Long(2017). Effect of electric current on fracture and constitutive behavior of Sn-Ag-Cu solder joints.Engineering Fracture Mechanics, V.171, pp. 85-97. (Q3, IF=1.818)
14.CH Chen*, YF Zhu, Y Yao, Y Huang,X Long(2016). An evaluation method to predict progressive collapse resistance of steel frame structures,Journal of Constructional Steel Research, V.122, pp. 238-250.(Q3, IF=1.464)
15.X Long*, YX Wang, LM Keer, Y Yao* (2016). Mechanical effects of isolated defects within a lead-free solder bump subjected to coupled thermal-electrical loading,Journal of Micromechanics and Molecular Physics, V. 1, No. 1:1650004 (invited paper).
16.X Long*, CK Lee (2015). Improved strut-and-tie method for 2D RC beam-column joints under monotonic loading,Computers and Concrete, V.15, No.5, pp.807-831. (Q4, IF=0.849)
17.X Long*, CK Lee (2015). Modelling of two dimensional reinforced concrete beam-column joints subjected to monotonic loading,Advances in Structural Engineering, V. 18, No. 9, pp. 1461-1474. (Q4, IF=0.577)
18.X Long*, F Ge, YS Hong (2015). Feasibility study on buoyancy-weight ratios of a submerged floating tunnel prototype subjected to hydrodynamic loads,Acta Mechanica Sinica, V. 31, No. 5, pp. 750-761. (Q4, IF=0.832)
19.19.X Long*, KH Tan, CK Lee (2014). Bond stress-slip prediction under pullout and dowel action in reinforced concrete joints,ACI Structural Journal, V. 111, No. 4, pp. 977-988. (Q3, IF=1.227)
20.X Long*, JQ Bao, KH Tan, CK Lee (2014). Numerical simulation of reinforced concrete beam/column failure considering normal-shear stress interaction,Engineering Structures, V. 74, September, pp. 32-43. (Q2, IF=1.893)
21.X Long*, WF Yuan, KH Tan, CK Lee (2013). A superelement formulation for efficient structural analysis in progressive collapse,Structural Engineering and Mechanics, V. 48, No. 3, pp. 309-331. (Q4, IF=1.021)
22.X Long*, KH Tan, CK Lee (2013). A 3D co-rotational beam element for steel and RC framed structures,Structural Engineering and Mechanics, V. 48, No. 5, pp. 587-613. (Q4, IF=1.021)
23.X Long*, F Ge, L Wang, YS Hong (2009). Effects of fundamental structure parameters on dynamic responses of submerged floating tunnel under hydrodynamic loads,Acta Mechanica Sinica, V. 25, No. 3, pp. 335-344. (Q4, IF=0.832)
24.JQ Bao*,X Long, KH Tan, CK Lee (2013). A new generalized Drucker–Prager flow rule for concrete under compression,Engineering Structures, V.56, pp. 2076–2082. (Q2, IF=1.893)
25.F Ge*,XLong, L Wang, YS Hong (2009). Flow-induced vibrations of long circular cylinders modeled by coupled nonlinear oscillators,Science China Series G: Physics Mechanics and Astronomy, V. 52, No. 7, pp. 1086-1093. (Q4, IF=1.575)
會議文章
1.X Long*, WB Tang, Y Yao, XZ Lu, J Liu, C Zhou, WJ Xia, YP Wu (2018). Estimating the constitutive behaviour of sintered silver nanoparticles by nanoindentation.19th International Conference on Electronic Packaging Technology(ICEPT 2018), IEEE, Shanghai, August 8-11, 2018. (EI)
2.WJ Wang, Y Yao,X Long*, ZH Zhu (2018). Material and structural optimization of fatigue life of PBGA under temperature cycling.19th International Conference on Electronic Packaging Technology(ICEPT 2018), IEEE, Shanghai, August 8-11, 2018. (EI)
3.HC Guo, Y Yao,X Long*(2018). Porosity effect on the constitutive model of porous material under nanoindentation.19th International Conference on Electronic Packaging Technology(ICEPT 2018), IEEE, Shanghai, August 8-11, 2018. (EI)
4.G He, Y Yao*, JD Wang, SB Wang,X Long*(2018). Aging effect on defect evolution and shear strength of nano-silver solder joint.19th International Conference on Electronic Packaging Technology(ICEPT 2018), IEEE, Shanghai, August 8-11, 2018. (EI)
5.C Li, CY Wang, PZ Zhao, SB Kang*,X Long(2018). Bond strength of embedded steel reinforcement at high strain rates. International fib Congress 2018, Melbourne, Australia.
6.XM Yu, SB Kang,X Long*(2018). Compressive strength of concrete reinforced by TiO2nanoparticles.2018 International Conference on Advanced Structural and Civil Engineering(ASCE 2018), Chongqing, August 18-19, 2018. (EI)
7.YC Liu, WW Wang, FR Jia, ZH Zhu,X Long*(2018). Temperature effect on tensile behaviour of Sn-Pb eutectic solder.International Conference on Mechanical Design, Manufacture and Automation Engineering(MDMAE2018), Xi’an, June 24-25, 2018. (EI)
8.X Long*, WB Tang, WJ Xia, YP Wu, LF Ren, Y Yao (2017). Porosity and Young's modulus of pressure-less sintered silver nanoparticles.19th Electronics Packaging Technology Conference(EPTC 2017), IEEE, Singapore, December 6-9, 2017, DOI: 10.1109/EPTC.2017.8277577. (EI)
9.X Long*, WB Tang, ZH Zhu, YP Wu, LF Ren, Y Yao (2017). Creep behavior of annealed lead-fee solder for high-power electronic device.2nd International Conference on Applied Mechanics and Mechatronics Engineering(AMME2017). Shanghai, November 26-27, DOI: 201710.12783/dtetr/amme2017/19478. (EI)
10.X Long*, WB Tang, ZH Zhu, YP Wu, LF Ren, Y Yao (2017). Determination of Young’s modulus of tensile specimen for lead-free solder.2nd International Conference on Applied Mechanics, Electronics and Mechatronics Engineering(AMEME2017), Beijing, October 22-23, 2017, DOI: 10.12783/dtetr/ameme2017/16239. (EI)
11.龍旭，湯文斌，王紹斌，何許，姚堯（2017），適用於SnAgCu焊料大應變率範圍的統一蠕變塑性本構模型，中國力學大會暨慶祝中國力學學會成立60周年大會，北京，2017年8月13-16日。
12.X Long*, Y Yao, YP Wu, WJ Xia, LF Ren (2017). Effect of thermal cycling on tensile behaviour of SAC305 solder.18th International Conference on Electronic Packaging Technology(ICEPT 2017), IEEE, Harbin, August 16-19, 2017, DOI: 10.1109/ICEPT.2017.8046408. (EI)
13.X Long, Y Yao*, LM Keer (2016). Effect of isolated intermetallic compounds under electromigration in lead-free solders.24th International Congress of Theoretical and Applied Mechanics, 21-26 August 2016, Montreal, Canada.
14.X Long*, BJ Chen, Y Yao (2016). Thermo-visco-plastic constitutive model for lead-containing and lead-free solders subjected to monotonic and cyclic loadings.17th International Conference on Electronic Packaging Technology(ICEPT 2016), IEEE, Wuhan, August 17-19, 2016, DOI: 10.1109/ICEPT.2016.7583084 (EI)
15.YX Wang,X Long*, Y Yao*(2016). Theoretical study of thermomigration effect on thepancake void propagation at the current crowdingzone of solder joints.17th International Conference on Electronic Packaging Technology(ICEPT 2016), IEEE, Wuhan, August 17-19, 2016, DOI: 10.1109/ICEPT.2016.7583174 (EI)
16.X Long*, HC Guo (2016). Fire resistance study of concrete in the application of tunnel-like structures.Procedia EngineeringV. 166, pp. 13-18. (EI)
17.X Long*, KH Tan, CK Lee (2013). Analytical model on the bond stress-slip relationship between steel reinforcement and concrete for RC beam-column joints.Applied Mechanics and MaterialsV. 275-277, pp. 1212-1218. (EI)
邀請報告
1.大功率電子器件封裝材料性能研究——電子封裝力學，2018套用力學與土木環境工程學術研討會，華中科技大學，武漢，2018.8.16。
2.力學在電子封裝行業中的套用，特邀學術報告，遼寧石油化工大學，2018.5.19。
3.大功率器件封裝材料力學性能研究，學術報告，西南科技大學，綿陽，2017.12.15。
4.電子封裝材料本構模型及其套用挑戰，2017 SIMULIA中國區用戶大會，達索系統SIMULIA，深圳，2017.11.30。
5.電力耦合下無鉛焊料蠕變行為，2017套用力學青年學術研討會，廣西大學，西寧，2017.8.4。
6.電子封裝結構力學可靠性，特邀學術報告暨兼職碩士研究生指導教師聘用匯報，遼寧石油化工大學，2017.6.19。
7.電子封裝中焊接材料及結構力學性能研究，2016 SIMULIA中國區用戶大會，達索系統SIMULIA，上海，2016.11.2。
8.電子封裝材料及結構力學性能研究，2016套用力學青年學術研討會，西南科技大學，綿陽，2016.8.14。
科研項目
1.主持國家自然科學基金委員會青年科學基金項目（2016年-2018年）
2.主持陝西省自然科學基礎研究計畫面上項目（2017年-2018年）
3.主持航天科學技術基金項目（2017年）
4.主持華為創新研究計畫（HIRP OPEN）（2018年）
5.主持中國航天科技集團公司西安空間技術研究院橫向外協項目（2017年）
6.主持中央高校基本科研業務費項目（2018年-2019年）
7.主持中央高校基本科研業務費項目（2016年-2017年）
8.主持西北工業大學全英文課程建設項目（2016年-2017年）
9.第一參與人，國家自然科學基金委員會國家自然科學基金面上項目（2018年-2021年）
10.第二參與人，國家自然科學基金委員會國家自然科學基金面上項目（2016年-2019年）
11.參加並完成南洋理工大學與新加坡內務部（Ministry of Home Affairs）合作項目（2010年-2014年）
榮譽獲獎
•ICEPT 2018最佳論文獎（Outstanding Paper Award），論文名稱：Estimating the constitutive behaviour of sintered silver nanoparticles by nanoindentation
•2017年度陝西高等學校科學技術獎一等獎，成果名稱：新型微電子封裝焊料及互聯結構可靠性研究，學科門類：數理力學，完成人：姚堯，喬吉超，龍旭，何許，王月興，姚志鋒[7]
•指導2017屆本科生畢業生蔚雪梅開展的“極端溫度下TiO2納米顆粒增強混凝土抗壓性能研究”，榮獲優秀本科畢業論文（2017年全專業唯一）
•指導2015級本科生徐孟飛開展的“高溫高電流所致無鉛焊點性能演化研究”，榮獲第十六屆“三航杯”大學生課外學術科技作品競賽（自然科學類學術論文）三等獎
•指導西北工業大學團隊作品“灃河渡”，榮獲2017年陝西省大學生結構設計競賽三等獎及“最佳製作獎” [3]
社會兼職
中國力學學會會員
IEEE Member
Quarterly Franklin Membership (Membership ID#YB95091)
International Journal of Applied Mechanics (Q3, IF=1.468), Transactions on Components, Packaging and Manufacturing Technology (Q4, IF=1.660), Journal of Manufacturing Processes (Q3, IF=2.809) 期刊審稿人
