![黃明亮[大連理工大學教授]](/img/f/71c/nBnauM3X4IDO4IDN1AjN0ETN1UTM1QDN5MjM5ADMwAjMwUzLwYzL4czLt92YucmbvRWdo5Cd0FmLxE2LvoDc0RHa.jpg "黃明亮[大連理工大學教授]")
個人簡歷
1992年、1995年、2001年在大連理工大學分別獲學士、碩士、博士學位。
1998-2001年香港城市大學電子封裝與組裝中心；
2003-2004年韓國科學技術院（KAIST）電子封裝材料中心；
2004年-2006年德國微電子與微系統集成研究院IZM晶片連線與先進封裝部門進行研究。
2006年歸國任教授。
社會兼職
美國TMS（礦物、金屬、材料）學會會員。
《Journal of Materials Science and Technology》學術期刊編委。
國際期刊《Journal of Alloys and Compounds》，《Philosophical Magazine Letters》評閱人。
研究領域
[1] 國家自然科學基金重點項目：無鉛化電子封裝釺焊界面反應及焊點可靠性的基礎研究(U0734006)、項目負責人。
[2] 國家自然科學基金面上項目：微凸點中電遷移與Sn晶粒取向相互作用研究（51475072）、項目負責人。
[3] 國家自然科學基金面上項目：單晶基體界面反應及其對微細無鉛焊點可靠性的影響(51171036)、項目負責人。
[4] 國家自然科學基金國際合作與交流項目：可穿戴電子產品釺料-ACF柔性微互連Sn各向異性及電遷移行為研究（51511140289）、項目負責人。
[5] 國家自然科學基金國際合作與交流項目：無鉛化電子封裝中固/液界面反應研究(50811140338)、項目負責人。
[6] 國家自然科學基金國際合作與交流項目：2013年第十四屆電子封裝技術國際學術會議(51310305047)、項目負責人。
[7] 國家自然科學基金專項基金：從基體金屬溶解的角度研究現代電子封裝中固/液界面反應(50641007)、項目負責人。
[8] 國家科技支撐計畫課題：無鉛焊料系列產品的開發及產業化(2006BAE03B02)、170萬元、項目負責人。
[9] 中國航天科技集團高校專項科研計畫項目：倒裝晶片焊陶瓷封裝可靠性評估(20130731）、項目負責人。
[10] 軍工項目、XXXXX、項目負責人。
[11] 國家教育部新世紀優秀人才支持計畫項目：超薄晶片連線技術研究(NCET-06-0273)、項目負責人。
[12] 百千萬人才工程項目：大功率高亮度氮化鎵LED晶片倒裝連線技術的研究(2009921058)、項目負責人。
[13] 國家教育部重點引智項目：無鉛化電子封裝釺焊界面反應的研究（200945）、項目負責人。
[14] 國家教育部博士點基金：無鉛化電子封裝固/液界面反應的基礎研究（20070141062）、項目負責人。
[15] 國家教育部留學回國人員科研啟動基金：大功率高亮度氮化鎵LED晶片倒裝連線的研究（[2007]1108）、項目負責人。
[16] 遼寧省自然科學基金項目：電子封裝無鉛微連線的基礎問題（20082163）、項目負責人。
[17] 遼寧省自然科學基金項目：電子封裝無鉛釺料的研究（20021067）、項目負責人。
[18] 遼寧省重點實驗室項目：微小尺寸無鉛釺料連線技術（20060133）、項目負責人。
[19] 大連市科技計畫重大項目：大功率低成本GaN基LED的封裝技術與產業化（2006A11GX005）、項目負責人。
[20] 大連理工大學基本科研業務費重大項目培育專題：以先進焊接材料實現製冷行業鋁代銅重大技術進步（DUT13ZD201）、項目負責人。
[21] 大連理工大學特色方向課題：積體電路特色專業方向建設、項目負責人。
[22] 華為技術有限公司等大型企業橫向合作項目等。
著作論文
出版著作和論文
Scientific Reports, Applied Physics Letters, Journal of Applied Physics, Scripta Materialia, Journal of Materials Science, Journal of Materials Research, Journal of Electronic Materials, Journal of Alloys and compounds, IEEE Trans. On Advanced Packaging等刊物上發表的學術論文149篇。
2016年發表論文目錄
[1] M.L. Huang, F. Yang, N. Zhao, Thermomigration-induced asymmetrical precipitation of Ag3Sn plates in micro-scale Cu/Sn-3.5Ag/Cu interconnects, Materials & Design, 89, pp. 116-120, 2016.
2015年發表論文目錄
[1] M.L. Huang, F. Yang, N. Zhao, Z.J. Zhang, In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction, Materials Letters, 139, pp. 42–45, 2015.
[2] M.L. Huang, Z.J. Zhang, N. Zhao, F. Yang, In situ study on reverse polarity effect in Cu/Sn-9Zn/Ni interconnect undergoing liquid-solid electromigration, Journal of Alloys and Compounds, 619, pp. 667-675, 2015.
[3] L. Qu, N. Zhao, H.T. Ma, H.J. Zhao, M.L. Huang. In situ study on current density distribution and its effect on interfacial reaction in a soldering process. Journal of Electronic Materials, 44(1), pp.467-474, 2015.
[4] M. L. Huang, F. Yang, Size effect on interfacial reactions of Sn-3.0Ag-0.5Cu solder balls on Cu and Ni-P pads, Journal of Materials Science: Materials in Electronics, 26, pp.933–942, 2015.
[5] N. Zhao, M.L. Huang, Y. Zhong, H. T. Ma, X. M. Pan, Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eutectic Sn–0.7Cu solder, J Mater Sci: Mater Electron, 26, pp.345–352, 2015.
[6] M.L. Huang, F. Yang, Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints, Journal of Materials Science & Technology, 31(3), pp. 252-256, 2015.
[7] M. L. Huang, F. Zhang, F. Yang, N. Zhao, Size effect on tensile properties of Cu/Sn9Zn/Cu solder interconnects under aging and current stressing, Journal of Materials Science: Materials in Electronics, 26(4), pp.2278-2285, 2015.
[8] M.L. Huang*, Z.J. Zhang, N. Zhao, F. Yang, Migration behavior of indium atoms in Cu/Sn-52In/Cu interconnects during electromigration, Journal of Materials Research, 30(21), pp. 3316-3323, 2015.
[9] M.L. Huang*, J.F. Zhao, Z.J. Zhang, N. Zhao, Role of diffusion anisotropy in beta-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration, Acta Materialla, 100, pp. 98-106, 2015.
[10] M.L. Huang*, N. Zhao, Effect of Electromigration on the Type of Drop Failure of Sn-3.0Ag-0.5Cu Solder Joints in PBGA Packages, Journal of Electronic Materials, 44(10), pp. 3927-3933, 2015.
[11] N. Zhao, Y. Zhong, M.L. Huang, H.T. Ma, W. Dong, Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient, Scientific Reports, 5, pp. 13491, 2015.
[12] N. Zhao, Y. Zhong, M.L. Huang, H.T. Ma, X.P. Liu, Effect of thermomigration on the growth kinetics of Cu6Sn5 at liquid-solid interfaces in Cu/Sn/Cu solder joints, 64(16) 特刊SI: 166601, 2015.
[13] M.L. Huang, Applications of synchrotron radiation real-time imaging technology in characterizing the reliability of micro bumps in electronic packaging, 2015 China Semiconductor Technology International Conference，2015. 特邀報告
[14] J.F. Zhao, M.L. Huang, N. Zhao, Z.J. Zhang, Effect of Sn grain orientation on Cu diffusion in SnAgCu solder interconnect undergoing electromigration, 16th International Conference on Electronic Packaging Technology, August 11-14, Changsha, pp. 1275-1278, 2015.
[15] Yawei Liu; Mingliang Huang; Feifei Huang; Ning Zhao, Effects of stirring speed on composition and morphology of non-cyanide co-electroplating Au-Sn thin films, 16th International Conference on Electronic Packaging Technology Changsha, August 11-14, pp. 1283-1286, 2015.
[16] Liwei Xu; Mingliang Huang; Quanbin Yao; Yong Wang; Binhao Lian, Effect of Cu on interfacial reaction in high-lead solder bumps, 16th International Conference on Electronic Packaging Technology Changsha, August 11-14, pp. 1279-1282, 2015.
[17] Ning Zhao; Yi Zhong; Mingliang Huang; Haitao Ma, Interfacial reactions in Cu/Sn/Cu(Ni) systems during soldering under temperature gradient, 16th International Conference on Electronic Packaging Technology, August 11-14, pp. 1263-1266, 2015.
[18] Yi Zhong; Mingliang Huang; Haitao Ma; Ning Zhao, Synchrotron radiation in situ study on liquid-solid thermomigration in Cu/Sn/Ni solder joint, 16th International Conference on Electronic Packaging Technology, August 11-14, pp. 1271-1274, 2015.
[19] J.X. Liu, M.L. Huang, N. Zhao, L.W. Zhang. Microstructure and Mechanical Properties of Al/Sn-Zn-X/Cu Solder Joints, 16th International Conference on Electronic Packaging Technology, August 11-14, pp. 1267 - 1270, 2015.
[20] 黃明亮, 張志傑, 馮曉飛, 趙寧, 液-固電遷移Ni/Sn-9Zn/Ni焊點反極性效應研究, 金屬學報, 51 (1), pp. 93-99, 2015.
[21] 黃明亮，馮曉飛，趙建飛，張志傑，Cu/Sn-58Bi/Ni焊點液-固電遷移下Cu和Ni的互動作用，中國有色金屬學報（The Chinese Journal of Nonferrous Metals）,25(4),2015.
2014年發表論文目錄
[1] M. L. Huang, F. Yang, Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate, Scientific Reports, 4, p.7117, 2014.
[2] X.Y. Liu, M.L. Huang, N. Zhao, L. Wang, Liquid-state and solid-state interfacial reactions between Sn–Ag–Cu–Fe composite solders and Cu substrate, Journal of Materials Science: Materials in Electronics, 25, pp. 328-337, 2014.
[3] M.L. Huang, Q. Zhou, N. Zhao, X.Y. Liu, Z.J. Zhang, Reverse polarity effect and cross-solder interaction in Cu/Sn-9Zn/Ni interconnect during liquid-solid electromigration, Journal of Materials Science, 49, pp. 1755-1763, 2014.
[4] L. Qu, N. Zhao, H.J. Zhao, M.L. Huang, H.T. Ma, In situ study of the real-time growth behavior of Cu6Sn5 at the Sn/Cu interface during the soldering reaction, Scripta Materialia, 72-73, pp. 43-46, 2014.
[5] M. L. Huang, X. L. Hou, N. Kang, Y. C. Yang, Microstructure and interfacial reaction of Sn–Zn–x(Al,Ag) near-eutectic solders on Al and Cu substrates, J Mater Sci: Mater Electron 25, pp. 2311–2319, 2014.
[6] M.L. Huang, F. Yang, N. Zhao, Y.C. Yang, Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50 μm Sn-Ag-Cu solder bumps, Journal of Alloys and Compounds, 602, pp. 281–284, 2014.
[7] L. Qu, N. Zhao, H.T. Ma, H.J. Zhao, M.L. Huang, In situ study on the effect of thermomigration on intermetallic compounds growth in liquid-solid interfacial reaction. Journal of Applied Physics, 115(20), p. 204907, 2014.
[8] M.L. Huang, Z.J. Zhang, S.M. Zhou, and L.D. Chen, Stress relaxation and failure behavior of Sn-3.0Ag-0.5Cu flip chip solder bumps undergoing electromigration, Journal of Materials Research, 29, pp. 2556-2564, 2014.
[9] M.L. Huang, F.F. Huang, J.L. Pan, T.X. Zhang, Composition control of co-electroplating Au–Sn deposits using experimental strategies, Journal of Materials Science: Materials in Electronics, 25, pp. 4933-4942, 2014.
[10] M.L. Huang, Z.J. Zhang, H.T. Ma, L.D. Chen, Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration, Journal of Materials Science & Technology, 30(12), pp. 1235-1242, 2014.
[11] N. Zhao, M. L. Huang, H. T. Ma, F. Yang, Z.J. Zhang, Influence of rare earth Ce addition on the microstructure, properties and soldering reaction of pure Sn, Metals and Materials International, 20(5), pp. 953-958, 2014.
[12] M.L. Huang, Electromigration Reliability of Lead-free Solder Interconnects, ECS Transactions, 60(1), pp. 811-816, 2014. 特邀報告
[13] M.L. Huang, F. Yang, N. Zhao, X.H. Liu, J.Y. Wang, Study on size effect and cross-interaction in Cu/Sn/Ni-P interconnects, 15th International Conference on Electronic Packaging Technology, August 12-15, Chengdu, China, pp. 429-432, 2014.
[14] M.L. Huang, F. Zhang, F. Yang, N. Zhao, Effect of electromigration on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects, 15th International Conference on Electronic Packaging Technology, August 12-15, Chengdu, China, pp. 1190-1193, 2014.
[15] M.L. Huang, Z.J. Zhang, N. Zhao, X.F. Feng. Reverse polarity effect in Cu/Sn-9Zn/Ni interconnect under 2 × 104 A/cm2 at 230 oC. 15th International Conference on Electronic Packaging Technology, August 12-15, Chengdu, China, 2014.
[16] S. Li, Y. Du, L. Qu, A. Kunwar, J.H. Sun, J.H. Liu, N. Zhao, M.L. Huang, H.T. Ma. The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows. 15th International Conference on Electronic Packaging Technology, August 12-15, Chengdu, China, 2014.
[17] Q. Zhou, Y. Zhou, X. Qin, X.J. Wang, M.L. Huang, Different diffusion behavior of Cu、Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects under L-S electromigration, 15th International Conference on Electronic Packaging Technology, August 12-15, Chengdu, China, 2014.
2013年發表論文目錄
[1] N. Zhao, X. Y. Liu, M. L. Huang, H. T. Ma, Characters of multicomponent lead-free solders, Journal of Materials Science-Materials in Electronics, 24(10), pp. 3925-3931, 2013/10.
[2] M. L. Huang, Q. Zhou, N. Zhao, Z. J. Zhang, Abnormal Diffusion Behavior of Zn in Cu/Sn-9 wt.%Zn/Cu Interconnects During Liquid-Solid Electromigration, Journal of Electronic Materials, 42(10), pp. 2975-2982, 2013.
[3] M.L. Huang, Z.J. Zhang, N. Zhao, Q. Zhou, A synchrotron radiation real-time in situ imaging study on the reverse polarity effect in Cu/Sn–9Zn/Cu interconnect during liquid–solid electromigration, Scripta Materialia, 68(11), pp. 853-856, 2013.
[4] M.L. Huang, Q. Zhou, N. Zhao, L.D. Chen, Interfacial microstructure and mechanical properties of In-Bi-Sn lead-free solder, Journal of Materials Science: Materials in Electronics, 24(7), pp. 2624-2629, 2013.
[5] M.L. Huang, Z.J. Zhang, N. Zhao, X.F. Feng, Study on Liquid-Solid Electromigration in Cu/Sn-9Zn/Cu Interconnect Using Synchrotron Radiation Real-Time in Situ Imaging Technology, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 126-129, 2013.
[6] M.L. Huang, T.X. Zhang, N. Zhao, T.T. Jiao, Interfacial Reactions of Co-electrodeposited Eutectic Au-Sn Solder Bumps on Ni and Cu Substrates, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 225-228, 2013.
[7] M.L. Huang, T. Liu, N. Zhao, H. Hao, Interfacial Reaction in Cu/Sn/Cu Fine Pitch Interconnect during Soldering, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 382-385, 2013.
[8] M.L. Huang, F. Yang, N. Zhao, F. Zhang, Dissolution and Precipitation of Ag3Sn Plates in Ultra Fine Solder Joints Using Synchrotron Radiation Real-time Imaging Technology, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 822-825, 2013.
[9] M.L. Huang, X.L. Hou, H.T. Ma, J. Zhao, Y.C. Yang, Interfacial Reaction and Mechanical Properties of Al/Sn-Zn-Ni/Cu Solder Joints, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 879-882, 2013.
[10] M.L. Huang, Q. Zhou, H.T. Ma, J. Zhao, Effect of Liquid-solid Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu Solder Joint, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 1090-1093, 2013.
[11] M.L. Huang, S. Liu, N. Zhao, H. Long, J.H. Li, W.Q. Hong, Drop Failure Modes of A Wafer-Level Chip-Scale Packaging, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 1094-1098, 2013.
[12] X.Y. Liu, M.L. Huang, N. Zhao, L. Wang, Effect of Fe addition to Sn-3Ag-0.5Cu solder on interfacial reactions during aging, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 400-402, 2013.
[13] L.D. Chen, Y. Feng, X.Y. Liu, M.L. Huang, Effects of Temperature and Current Density on (Au,Pd,Ni)Sn4 Redistribution and Ni-P Consumption in Ni/Sn3.0Ag0.5Cu/ENEPIG Flip Chip Solder Joints, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 1064-1069, 2013.
[14] L.L. An, H. Ma, L. Qu, J. Wang, J.H. Liu, M.L. Huang, The Effect of Laser-soldering Parameters on the Sn-Ag-Cu/Cu Interfacial Reaction, 14th International Conference on Electronic Packaging Technology, Dalian, China, pp. 264-267, 2013.
[15] L. Qu, H. Ma, H.J. Zhao, N. Zhao, A. Kunwar, M.L. Huang, The nucleation of Ag3Sn and the growth orientation relationships with Cu6Sn5, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 377-381, 2013.
[16] X.Y. Liu, M.L. Huang, N. Zhao, Interfacial reactions between Sn-Ag-Cu-Fe composite solder and Cu substrate, 3rd International Conference on Mechatronics and Intelligent Materials (MIM 2013), May 18-19, Xishuangbanna, China, pp. 138-141, 2013.
[17] M.L. Huang, F. Yang, N. Zhao, X.Y. Liu, Solder Volume Effect on Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder Balls and Cu Substrates - Experiment & Simulation, ECS Transactions, 52 (1), pp. 753-758, 2013.
[18] 趙寧，黃明亮，馬海濤，潘學民，劉曉英，液態Sn-Cu釺料的黏滯性與潤濕行為研究，物理學報，62(8)，p. 086601，2013．
[19] 黃明亮，周少明，陳雷達，張志傑，Ni-P消耗對焊點電遷移失效機理的影響，金屬學報，49(1)，pp. 81-86，2013．
[20] 黃明亮，陳雷達，趙寧，Cu-Ni互動作用對Cu/Sn/Ni焊點液-固界面反應的影響，中國有色金屬學報，23(4)，pp. 1073-1078，2013．
2012年發表論文目錄
[1] M.L. Huang, J.L. Pan, H.T. Ma, N. Zhao, Interfacial reactions of sequentially electroplated Au/Sn/Au films on Si chips, Materials Science and Technology, 28(7), pp. 837-843, 2012.
[2] M.L. Huang, S.M. Zhou, L.D. Chen, Electromigration-induced interfacial reactions in Cu/Sn/electroless Ni-P solder interconnects, Journal of Electronic Materials, 41(4), pp. 730-740, 2012.
[3] H.T. Ma, L. Qu, M.L. Huang, L.Y. Gu, N. Zhao, L. Wang, In-situ study on growth behavior of Ag3Sn in Sn–3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology, Journal of Alloys and Compounds, 537, pp. 286-290, 2012.
[4] M.L. Huang, N. Kang, Q. Zhou, Y. Z. Huang, Effect of Ni Content on Mechanical Properties and Corrosion Behavior of Al/Sn-9Zn-xNi/Cu joints, Journal of Materials Science & Technology, 28(9), pp. 844-852, 2012.
[5] H.T. Ma, J. Wang, L. Qu, L.L. An, L.Y. Gu, M.L. Huang, The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu substrate, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 361-365, 2012.
[6] H.T. Ma, L. Qu, H.J. Zhao, J. Wang, L.Y. Gu, L. L. An, M.L. Huang, In-situ study on the formation and evolution behavior of voids at the interface during soldering process by synchrotron radiation real-time imaging technology, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 380-384, 2012.
[7] H.T. Ma, L.L. An, L. Qu, J. Wang, L.Y. Gu, M.L. Huang, Interfacial Reaction between Sn-9Zn/Sn Double Layers Solder and Cu, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 393-397, 2012.
[8] X.Y. Liu, M.L. Huang, N. Zhao, Effect of Cu6Sn5 particles on microstructure formation and mechanical properties of Sn-58Bi solder, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 423-425, 2012.
[9] T. Liu, M.L. Huang, N. Zhao, Interfacial Reactions between Cu Single Crystals and Lead-free Solders during Solid-State Aging, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 494-498, 2012.
[10] F. Yang, M.L. Huang, N. Zhao, Study on Short Time Interfacial Reactions between Sn-3.0Ag-0.5Cu Solder Balls and ENEPIG Pads, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 499-502, 2012.
[11] X.H. Wang, M.L. Huang, F. Yang, N. Zhao, Simulation of IMC Layer Growth and Cu Consumption in Sn-Ag-xCu/Cu Solder Joints during Reflow, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 823-827, 2012.
[12] S. Pan, M.L. Huang, N. Zhao, S.M. Zhou, Z.J. Zhang, Dissolution of Substrates in Line-type Cu/Sn/Cu and Cu/Sn/Ni Interconnects under Current Stressing, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 1399-1402, 2012.
[13] Q. Zhou, M.L. Huang, N. Zhao, Z.J. Zhang, Effects of Cooling Rate and Solder Volume on the Formation of Large Ag3Sn Plates in Sn-Ag Based Solder Joints, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 1403-1406, 2012.
[14] M.L. Huang, Solder Volume Effect on Interfacial Reaction of Sn-3.0Ag-0.5Cu Solder Balls Experiment & Simulation, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, 2012. 特邀報告.
[15] F. Yang, L.W. Liu, Q. Zhou, T. Liu, M.L. Huang, Effect of Solder Volume on Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder Balls and the Substrates, ECS Transactions, 44 (1), pp. 885-890, 2012.
[16] 劉曉英，馬海濤，羅忠兵，趙艷輝，黃明亮，王來，Fe粉對Sn3Ag0.5Cu複合釺料組織及性能的影響，中國有色金屬學報，22(4)，pp. 1169-1176，2012．
[17] 黃明亮，陳雷達，周少明，趙寧，電遷移對Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P倒裝焊點界面反應的影響，物理學報，61(19)，pp. 198104(1-9)，2012．
[18] 陳雷達，周少明，黃明亮，電遷移對Ni/Sn/Ni-P焊點界面反應的影響，稀有金屬材料與工程，41(10)，pp. 1785-1789，2012．
[19] 黃明亮，陳雷達，周少明，電遷移對Ni/Sn3.0Ag0.5Cu/Cu焊點界面反應的影響，金屬學報，48(3)，pp. 321-328，2012．
[20] 潘劍靈，黃明亮，趙寧，分步法電鍍製備的Au-Sn共晶凸點的微觀組織，中國有色金屬學報，22(7)，pp. 2016-2022，2012．
[21] 程從前，黃明亮，趙傑，薛冬峰，均恆磁場對Cu與液態SnZn合金間化合物層結晶行為的影響(英文)，中國有色金屬學報(英文版)，22(9)，pp. 2312-2319，2012．
Applied Physics Letters, Journal of Materials Research, Journal of Electronic Materials, Journal of Alloys and compounds, IEEE Trans. On Advanced Packaging等刊物上發表的學術論文。
SCI統計：目前已被引用250次。
2011年發表論文目錄
1．M.L. Huang, Y. Liu, J.X. Gao, Interfacial Reaction between Au and Sn films electroplated for LED bumps, Journal of Materials Science: Materials in Electronics, 22, 2011, pp. 193-199 DOI 10.1007/s10854-010-0113-z
2．M.L. HUANG, Y.Z. HUANG, H.T. MA, and J. ZHAO, Mechanical Properties and Electrochemical Corrosion Behavior of Al/Sn-9Zn-xAg/Cu Joints, Journal of ELECTRONIC MATERIALS, 40(3), 2011, pp.315-323, DOI: 10.1007/s11664-010-1459-y, 2010年12月Online
2010年發表論文目錄
1．L. D. Chan, M. L. Huang, S.M. Zhou, Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect, Journal of Alloys and Compounds, 504, 2010, pp.535-541.
2．X.Y. Liu, M.L. Huang, C.M.L. Wu, L. Wang, Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder, Journal of Materials Science: Materials in Electronics, 21, 2010, pp.1046-1054, DOI 10.1007/s10854-009-0025-y.
3．Xiaoying Liu, Mingliang Huang, Yanhui Zhao, C.M.L. Wu, Lai Wang, The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during soldering, Journal of Alloys and Compounds, Vol. 492, 2010, pp. 433-438. (SCI)
4．L. D. Chan, M. L. Huang, S.M. Zhou, Effect of electromigration on intermetallic compound formation in Cu/Sn/Cu and Cu/Sn/Ni interconnects, The 60th Electonic Components and Technology Conference, IEEE, Nevada, USA, June 1-4, 2010 pp.176-181. 大會論文及口頭報告
5．黃明亮，柏冬梅, 化學鍍Ni-P與Sn-3.5Ag在釺焊及時效過程中的界面反應, 中國有色金屬學報,vol. 20, No.6, 2010年6月，pp.1189-1194
6．柏冬梅，黃明亮，鍍液pH值及濃度對鋁基表面化學鍍鎳-磷鍍層磷含量及鍍速的影響，機械工程材料，2010年6月，第34卷第6期，pp.28-32。
7．張福順，黃明亮，潘劍靈，王來，無氰金-錫合金電鍍液的成分最佳化及電流密度確定，機械工程材料，2010年11月，第34卷第11期，pp.50-54。
8．M. L. Huang, L. Wang, J. Zhao, Interfacial Reactions and Reliability Issues of Fine Pitch Flip-Chip Lead-free Solder Joints, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China （國際會議ICEPT-HDP特邀報告）
9．Huan Liu, Mingliang Huang, Haitao Ma, Yipeng Cui, Comparative Study of Interfacial Reactions of High-Sn Pb-free Solders on (001) Ni Single Crystal and on Polycrystalline Ni, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China, pp. 293-298. （國際會議論文）
10．Jianling Pan, Mingliang Huang, Au–Sn Co-electroplating solution for Flip Chip-LED Bumps, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China, pp. 283-287.
11．Nanzi Fan, Mingliang Huang, Lai Wang, Electroless Nickel-Boron Plating on Magnesium Alloy, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China, pp. 288-292.
12．Luwei Liu, Mingliang Huang, Effect of Solder Volume on Interfacial Reactions between Sn3.5Ag0.75Cu Solder Balls and Cu Pad, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China, pp. 299-304.
13．Shaoming Zhou, Mingliang Huang, Leida Chen, Electromigration-induced interfacial reactions in line-type Cu/Sn/ENIG interconnect, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China, pp. 467-471.
14．Yingzhuo Huang, Mingliang Huang, Ning Kang, Mechanical Property and Electrochemical Corrosion Behavior of Al/Sn-9Zn-XNi/Cu Joints, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China, pp. 422-428.
15．Song Ye, Mingliang Huang, Leida Chen, Xiaoying Liu, Electromigration of 300 μm diameter Sn-3.0Ag-0.5Cu lead-free bumps in flip chip package, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China, pp. 1132-1137.
16．Leida Chen, Mingliang Huang, Shaoming Zhou, Song Ye, Effect of electromigration on the Cu-Ni cross-interaction in line-type Cu/Sn/Ni interconnect, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China, pp. 324-329.
所獲獎勵
教育部新世紀優秀人才（2006年入選）；
遼寧省“百千萬人才工程” 百人層次人才（2009年入選）；
德國洪堡基金獎（洪堡學者）（2004年2月~2006年2月）；
遼寧省科學技術發明二等獎；
2005年獲得IEEE在新加坡主辦的國際電子封裝技術會議(EPTC)的最優會議論文獎。
2009年獲得ICEPT-HDP國際電子封裝技術會議優秀會議論文獎。
發明專利
1. 黃明亮，潘劍靈，卿湘勇，馬海濤，王來，一種無氰Au-Sn合金電鍍液的共沉積電鍍方法，發明專利申請號：200910187274.5。
2. 趙傑，黃明亮，於大全，王來，錫鋅基含稀土元素的無鉛釺料合金，已授權的中國發明專利號: ZL02109623.6，授權公告日:2004年11月17日。
3. 馬海濤，王來，馬洪列，黃明亮，趙傑，一種SnZn系無鉛釺料用助焊劑及其製備方法，已授權的中國發明專利號: ZL200710010114.4，授權公告日:2009年01月28日。
